Handle

ultrathin wafers safely

Integrate

safe thinning and handling into your process

Advance

to revolutionary applications

Check out our Video Demos

Ultrathin Wafers

Ultrathin wafers are hard to handle. They will sag, warp and bow in standard wafer cassettes. Tru-Si's NoTouch technology loads and unloads wafers into special pods for safe transfer between tools.

NoTouch Handling

Tru-Si's NoTouch handling technology can manage all wafer handling within the tool. The NoTouch holder levitates wafers on a cushion of air, protecting the wafers and the costly circuitry built upon them.

Your Process

With Tru-Si's flexible integration you can produce ultrathin, damage-free wafers and dice with your known methods and tools.

Tru-Si NoTouch Wands / Semiconductor Wands

Tru-Si's NoTouch™ hand-held wands enable manual handling of flexible ultra thin to rigid full thickness wafers without touching or damaging them. Silicon, GaAs, InP, and other similar material can all be handled using the same wand. Even extremely uneven surfaces, such as bumped or dirty wafers, are no problem for NoTouch™ wands.   more ››

Tru-Si NoTouch End Effectors / Semiconductor End Effectors

Tru-Si's NoTouch™ robotic end effectors enable automatic handling of flexible ultra thin to rigid full thickness wafers without touching or damaging them. Silicon, GaAs, InP, and other similar material can all be handled using the same end effector. Even extremely uneven surfaces, such as bumped or dirty wafers, are no problem for NoTouch™ end effectors.   more ››

About Tru-Si

Founded in 1997, Tru-Si Technologies, Inc. provides thin wafer handling products (end effectors and wands) to the semiconductor industry in order to meet increasing wireless, portable, networking, and internet market demands for smaller, thinner, cheaper, and more integrated electronic devices.   more ››

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