Company Overview

Founded in 1997, Tru-Si Technologies, Inc. serves the global semiconductor industry with innovative technologies for thin wafer processes and new chip-to-chip interconnection structures. Thin wafers are key in producing increasingly smaller, higher density, more functional and less costly chips used in wireless, portable, smart-card, networking and Internet applications. Tru-Si delivers solutions for damage-free wafer thinning, thin-wafer damage and stress removal, ultra-thin wafer handling, flexible integration of thin-wafer processing tools and advanced technologies focused on enabling new generations of 3D system-in-a-package (SIP) devices.

In June 2001, Tru-Si introduced the industry's first flexible integration of ultra-thin wafer operations. Incorporating its NoTouch^TM handling technology, this integration facilitates transfer of wafers within a tool and from tool-to-tool, resolving a major obstacle to the processing of thin wafers. To ensure that customers can use tools of their choice for thinning operations like grinding, de-taping, film frame mounting and dicing, the Company has begun to establish alliances with the manufacturers of those technologies and has initiated efforts to establish industry standards for integration-related components through major industry trade organizations.

For total thinning solutions in demanding damage and stress-free applications, Tru-Si can integrate its proven ADP processing equipment to deliver cost efficient manufacturing solutions for advanced packaging applications such as damage free thinning, damage free dicing and wafer stacking or thru-silicon interconnects.

Tru-Si also develops an IP business based on its Thru-Silicon^TM interconnection application. This technology maintains the economies of scale inherent in processing whole wafers by providing through-silicon vertical interconnections between the front and backsides of a wafer in a manner similar to that of through-holes in printed circuit boards. New generations of 3D system-in-a-package solutions enabled by Thru-Silicon vias are in high demand by major semiconductor manufacturers. The Company began marketing its Thru-Silicon vias in late 1999 and has since received strong interest from a number of leading companies.

Tru-Si is headquartered in California's Silicon Valley, with sales and service representatives in all major semiconductor markets worldwide.