The Atmospheric Downstream Plasma (ADP) process is an ion-free chemical etch that thins and removes damage with a lower cost of ownership than other backside etching and damage removal methods. Any wafer, with or without bumps, with or without grinding damage, can be thinned using the ADP process to yield ultra-thin wafers that are flexible and resilient. With No-Touch handling, no damage is introduced on the front side, leaving the whole wafer damage free.