<HEAD><TITLE>Jan-1999: Tru-Si Technologies, Inc¹«Ë¾½Ò¿ªÁË°å¼Ó±¡ÏµÍ³µÄÕÊÄ»,Advanced Packaging</TITLE>
<META content="Based in Silicon Valley, California, Tru-Si Technologies is the world leader in manufacturing its proprietary Atmospheric Downstream Plasma (ADP) equipment for semiconductor wafer processing applications." name=description>
<META content="Processing Equipment, flat panel display, cleaning equipment, dry etch systems, photoresist application, stripping systems," name=keywords>
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<H2>Tru-Si Unveils Wafer Thinning Systems, Advanced Packaging</H2>
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<H3>Publication: Advanced Packaging</H3>Sunnyvale, CALIF.—Tru-Si Technologies has introduced the Tru-Etch 2000 and Tru-Etch 3000 all dry etching systems for thinning silicon wafers. The systems will enable a new era for Moore's Law by opening a new dimension for the semiconductor packaging industry by allowing the vertical size of advanced packages to shrink to the previously unattainable limit of 2 mils. The system uses the company's proprietary Atmospheric Downstream Plasma and the No-Touch wafer handling technologies. <BR><BR></TD></TR></TBODY></TABLE></CENTER>
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<CENTER><B>Tru-Si Technologies</B><BR>657 N. Pastoria Ave. <BR>Sunnyvale, CA 94085 <BR>Phone: (408) 720-3333<BR>Fax: (408) 720-3334<BR>Email: <A href="mailto:inform@trusi.com">inform@trusi.com</A><BR><A href="http://www.trusi.com/" target=_top>Tru-Si Technologies Home Page</A><BR></CENTER><BR><BR></BODY>�