Thru-Silicon Via Services Thru-Silicon Interposer Via Drilling Via Filling - Copper Via Filling - Epoxy Copper CMP Front Side Patterning Grind & ADP Etching Back Side Patterning Stacking Wafer Processing Services Sputtered meta films Al, Cu, Ti-W, and Ni-V Mask aligner for 150mm and 200mm wafers Spincoaters for photoresist and photo-imageable polyimide Clean for SRD, RCA, HF dip, Sulfuric/Peroxide bath, and ultrasonic Wet processes for metal etching, oxide etching, and photoresist stripping HMDS vapor prime Additional Services Allied High Tech for cross section samples DW-2000 for mask layout

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