TE-1001/TE-2001

TE-1001-UT

Tru-Si's Tru-Etch 2001 family of atmospheric downstream plasma (ADP) gas etch systems provide post-grind thinning and back side damage removal for silicon wafers. Its damage free thinning capability improves wafer and die strength. The TE-1001-UT system offers the same capabilities as the TE-2001-UT system at a lower throughput and cost. The machine is easily upgradeable at a future date when throughput requirements increase.

TE-1001-UT Product Description (.pdf)

TE-2001-UT

Tru-Si's Tru-Etch 2001 family of atmospheric downstream plasma (ADP) gas etch systems provide post-grind thinning and back-side damage removal for silicon wafers. Its damage free thinning capability improves wafer and die strength. In the TE-2001-UT system, NoTouch^TM handling is used throughout to allow wafer thinning down to 50 µm.

TE-2001-UT Product Description(.pdf)